Flex, a U.S. manufacturer of electronics products and original design services, has acquired liquid cooling company JetCool Technologies.
Terms of the deal were not announced. etCool relies on what it calls microconvective direct liquid cooling to cool chips: essentially, instead of passing fluid over a surface, its cooling jets direct fluid directly onto the surface of a chip.
The approach can enable high-density cooling and align that cooling with the processor’s heat sources, the company says. It recently announced a refrigerant distribution unit (CDU) that can support racks up to 300 kW.
\”The addition of Flex will undoubtedly take JetCool technologies to new heights with its global footprint, extensive manufacturing capabilities and differentiated set of energy and data center offerings,\” said Dr. Bernie Malouin, CEO of JetCool. “We look forward to providing integrated liquid cooling systems and rack solutions with unmatched efficiency and scalability.”
JetCool and Flex announced a partnership last month, with the manufacturer launching custom, open-standards computing reference designs that integrate JetCool’s SmartPlate chip direct-to-chip liquid cooling solution.
\”We are thrilled to welcome JetCool and their talented team to Flex,” said Michael Hartung, president and chief commercial officer of Flex. “The addition of JetCool’s advanced liquid cooling technology strengthens our ability to help customers meet the increased power, thermal density and cooling requirements across the full spectrum of AI and high-performance computing workloads to achieve greater performance, efficiency and sustainability.”
Flex hopes to integrate the technology into its AI servers, along with its broader IT and energy infrastructure business.
Flex, formerly known as Flextronics, is one of the world’s largest electronics manufacturing services companies, behind Taiwan’s Pegatron, with annual revenues of $26.4 billion.
